{"582675":{"#nid":"582675","#data":{"type":"news","title":"What is New @ GT in Packaging? 5G and mm-wave Packaging","body":[{"value":"\u003Ch4\u003E\u003Cem\u003EGeorgia Tech and its industry partners are developing 5G and mm-wave packaging using ultra-thin Glass panel Fan-out technology with 10-100X improvement in bandwidth for consumer, computer, communication and automotive applications.\u003C\/em\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EThe explosive growth of data traffic from increasing number of digital and sensor devices, connected to the network, and the escalating demand for self-driving cars requiring both long-range vehicle-to-network and short-range vehicle-to-vehicle connectivity, has created a need for 10-100X increase in wireless data communication rates beyond current 4G LTE connectivity. This extreme traffic density requires high-frequency mobile bands, much beyond WLAN at 6 GHz, requiring mm-wave (e.g., 28-39 GHz and above) communications. Many challenges in achieving these goals such as those associated with system-level design, materials, processes, antennas and module integration must be addressed.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETraditional mm-wave packages are based on ceramic substrates. The high cost and low-integration limitations of ceramics have led to the evolution of organic packages. A fully-integrated antenna-in-package (AiP) for W-band phased-array system, with 64 dual-polarization antennas embedded in a multi-layer organic substrate, with SiGe transceiver dies that are flipchip-attached has been demonstrated by IBM. In addition, ultra-low loss organic substrates using Teflon and LCPs were explored with high gains and high bandwidth. The evolution of embedded and fan-out wafer level ball grid array package technology (eWLB) further enhanced the performance of mm-wave packages by eliminating the wirebonds, as demonstrated by Infineon technologies, with SiGe-BiCMOS technology. However, organic laminates and molding-compound based fan-outs are limited by the precision and tolerance of circuitry for mm-wave components.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn contrast to the above approaches for 5G and beyond, Georgia Tech and its industry partners are pioneering ultra-thin, panel-based glass fan-out (GFO) embedded technology. GFO offers many advantages such as low electrical loss, superior dimensional stability for precision circuitry, stability to high temperature and humidity, matched CTE to Si and other devices and availability in thin and large glass panels processed with Cu-through vias, similar in dimensions to TSVs and RDL wiring layers, and similar to BEOL on Si. The Georgia Tech approach leads to major design, material, process and 3D package architecture innovations.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESome of the key research innovations of the Georgia Tech 5G and beyond program include:\u003C\/p\u003E\r\n\r\n\u003Col\u003E\r\n\t\u003Cli\u003ELow-loss transmission with innovative waveguide structures on glass substrates with insertion losses approaching 0.05 dB\/mm.\u003C\/li\u003E\r\n\t\u003Cli\u003EFormation of precision circuitry enabled by high dimensional stability and surface smoothness of glass resulting in further lowering of the losses.\u003C\/li\u003E\r\n\t\u003Cli\u003EMiniaturized and high bandwidth, high gain antenna arrays enabled by glass, in combination with ultra-low loss thinfilm polymers with initial results indicating that the bandwidth can be improved by 20% with a gain of 10 dBi than those on organic substrates.\u003C\/li\u003E\r\n\t\u003Cli\u003EFormation of via arrays in glass with double-side interconnections enabling compact passive elements such as couplers and filters.\u003C\/li\u003E\r\n\t\u003Cli\u003EIntegrated power amplifiers with thermal management using large copper through-via structures in glass thus eliminating the hotspots and reliability issues with embedded high-power dies.\u003C\/li\u003E\r\n\t\u003Cli\u003EFeasibility of transparent RF electronics enabled by transparent glass substrates, transparent dielectrics and conductors in automotive windshields and windows.\u003C\/li\u003E\r\n\t\u003Cli\u003EInnovative materials and processes such as 3D printing on flex substrates being pioneered by Georgia Tech for low-cost IoT applications.\u003C\/li\u003E\r\n\t\u003Cli\u003EInnovative module integration of passives and actives with ultra-short interconnection length and ultra-small-vias in glass, resulting in very low via inductance, less than 50 pH and via-related transition losses, to less than 0.03 dB.\u003C\/li\u003E\r\n\u003C\/ol\u003E\r\n\r\n\u003Cp\u003EThe 5G project is currently active in collaboration with many industry partners, including glass companies such as Corning Glass, Asahi Glass, and Schott Glass, supplying the ultra-thin glass panels; low-loss dielectric material suppliers such as Rogers; tool companies such as Ushio for precision lithography; Disco for planarization and dicing; Atotech for supplying the plating chemistry for advanced metallization processes; and end-users like Qualcomm.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EAtom Watanabe is a PhD student under the advisement of Prof. Rao Tummala. His research focus is on EMI shielding and mm-wave module integration; \u003Ca href=\u0022mailto:atom@gatech.edu\u0022\u003Eatom@gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Manos Tentzeris, Ken Byers Professor in ECE Department, Georgia Tech, is the faculty lead for the mm-wave program; \u003Ca href=\u0022mailto:etentze@ece.gatech.edu\u0022\u003Eetentze@ece.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is the Joseph M. Pettit Chair Professor in ECE and MSE, and the Director of Georgia Tech\u0026rsquo;s 3D Systems Packaging Research Center (GT PRC); \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Raj Pulugurtha is a Research Professor and the Program Manager of Power and RF Module Programs; \u003Ca href=\u0022mailto:pm86@mail.gatech.edu\u0022\u003Epm86@mail.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Venky Sundaram is a Research Professor and the Program Manager of Glass Substrate Program; \u003Ca href=\u0022mailto:vs24@mail.gatech.edu\u0022\u003Evs24@mail.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners are developing 5G and mm-wave packaging using ultra-thin Glass panel Fan-out technology"}],"uid":"27850","created_gmt":"2016-10-17 18:01:37","changed_gmt":"2016-10-17 18:07:51","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-10-17T00:00:00-04:00","iso_date":"2016-10-17T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"582677":{"id":"582677","type":"image","title":"Printed mm-wave antenna arrays at Georgia Tech","body":null,"created":"1476727542","gmt_created":"2016-10-17 18:05:42","changed":"1476727542","gmt_changed":"2016-10-17 18:05:42","alt":"","file":{"fid":"222117","name":"Printed mm-wave antenna arrays at Georgia Tech PRC.png","image_path":"\/sites\/default\/files\/images\/Printed%20mm-wave%20antenna%20arrays%20at%20Georgia%20Tech%20PRC.png","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/Printed%20mm-wave%20antenna%20arrays%20at%20Georgia%20Tech%20PRC.png","mime":"image\/png","size":295936,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Printed%20mm-wave%20antenna%20arrays%20at%20Georgia%20Tech%20PRC.png?itok=NUGhHL5V"}},"582676":{"id":"582676","type":"image","title":"mm-Wave Characterization of transmission lines on glass with TPVs ","body":null,"created":"1476727467","gmt_created":"2016-10-17 18:04:27","changed":"1476727467","gmt_changed":"2016-10-17 18:04:27","alt":"","file":{"fid":"222116","name":"mm-Wave Characterization of transmission lines on glass with TPVs - Georgia Tech PRC.png","image_path":"\/sites\/default\/files\/images\/mm-Wave%20Characterization%20of%20transmission%20lines%20on%20glass%20with%20TPVs%20-%20Georgia%20Tech%20PRC.png","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/mm-Wave%20Characterization%20of%20transmission%20lines%20on%20glass%20with%20TPVs%20-%20Georgia%20Tech%20PRC.png","mime":"image\/png","size":70259,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/mm-Wave%20Characterization%20of%20transmission%20lines%20on%20glass%20with%20TPVs%20-%20Georgia%20Tech%20PRC.png?itok=vwyMkgTQ"}}},"media_ids":["582677","582676"],"groups":[{"id":"1237","name":"College of Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"172364","name":"5G"},{"id":"172479","name":"mm-wave packaging"},{"id":"172482","name":"antennea array"},{"id":"2621","name":"radar"},{"id":"62321","name":"Automotive"},{"id":"172480","name":"GFO"},{"id":"172481","name":"glass fanout"},{"id":"172373","name":"glass fan-out"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 385-1220\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["karen.may@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}