{"57036":{"#nid":"57036","#data":{"type":"news","title":"Gigascale Integration Group Wins Best Paper Honors","body":[{"value":"\u003Cp\u003EThe Gigascale Integration Group, based in the School of Electrical and Computer Engineering (ECE), has won two best paper awards. The group is led by James D. Meindl, the Joseph M. Pettit Chair Professor in ECE and director of both the Microelectronics Research Center and Nanotechnology Research Center.\n\u003C\/p\u003E\n\u003Cp\u003EThe group received the S.C. Sun Best Student Paper Award from the 2008 IEEE International Interconnect Technology Conference, which was held in San Francisco, Calif. last June. The award winning paper, \u0022A 3D-IC technology with integrated microchannel cooling,\u0022 was written by D. Sekar, C. King, B. Dang, T. Spencer, H. Thacker, P. Joseph, M. Bakir, and J. Meindl and was published in the Proc. IEEE Int. Interconnect Technol. Conf., pp. 13-15 in 2008. \n\u003C\/p\u003E\n\u003Cp\u003EThe paper described compact physical modeling and wafer-level batch fabrication technologies of advanced cooling technologies for 3D stack of high-performance chips. In particular, this paper reports, for the first time, the integration of electrical through-silicon vias with monolithic microchannel heat sink in 3D stack. The demonstrated technologies enable the liquid cooling of each chip in the stack. The reduced thermal resistance offered by microchannel cooling enables substantial improvement of clock frequency as well as reduced power dissipation for each chip in the 3D stack.\u003C\/p\u003E\n\u003Cp\u003EDr. Meindl\u0027s group also received the winning paper award of the Motorola Electronic Packaging Fellowship from the 2008 Electronic Components and Technology Conference (ECTC). The conference was held in Lake Buena Vista, Fla.  The award winning paper, \u00223D stacking of chips with electrical and microfluidic I\/O interconnects,\u0022 was written by C. King, D. Sekar, M. Bakir, B. Dang, J. Pikarsky, and J. Meindl and was published in the Proc. Electronic Components and Technol. Conf., pp. 1-7 in 2008. \n\u003C\/p\u003E\n\u003Cp\u003EThis paper described low-cost chip input\/output interconnect and assembly technologies to enable the \u0022routing\u0022 of electrical and fluidic networks in a 3D stack of chips. This is important because it enables, for the first time, the ability to deliver\u003Cbr \/\u003E\na coolant from the system motherboard directly to each silicon die in the stack to reject heat. These technologies offer significant cost, form factor, and performance benefits over \u0022typical\u0022 fluidic delivery methods.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"The Gigascale Integration Group, led by ECE Professor James D. Meindl, has won two Best Paper Awards","format":"limited_html"}],"field_summary_sentence":[{"value":"GSI Group won two Best Paper Awards at recent conferences"}],"uid":"27241","created_gmt":"2009-06-05 00:00:00","changed_gmt":"2016-10-08 03:02:55","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2009-06-05T00:00:00-04:00","iso_date":"2009-06-05T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"57037":{"id":"57037","type":"image","title":"tql38635.jpg","body":null,"created":"1449175327","gmt_created":"2015-12-03 20:42:07","changed":"1475894382","gmt_changed":"2016-10-08 02:39:42","alt":"","file":{"fid":"190520","name":"tql38635.jpg","image_path":"\/sites\/default\/files\/images\/tql38635_0.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/tql38635_0.jpg","mime":"image\/jpeg","size":60499,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/tql38635_0.jpg?itok=K4-GM_3h"}}},"media_ids":["57037"],"related_links":[{"url":"http:\/\/www.ece.gatech.edu\/","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/www.ece.gatech.edu\/research\/labs\/gsigroup\/","title":"Gigascale Integration Group"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"134","name":"Student and Faculty"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"}],"keywords":[{"id":"421","name":"Gigascale Integration Group"},{"id":"420","name":"James D. Meindl"},{"id":"166855","name":"School of Electrical and Computer Engineering"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cstrong\u003EJackie Nemeth\u003C\/strong\u003E\u003Cbr \/\u003ESchool of Electrical and Computer Engineering\u003Cbr \/\u003E\u003Ca href=\u0022mailto:jackie.nemeth@ece.gatech.edu\u0022\u003EContact Jackie Nemeth\u003C\/a\u003E\u003Cbr \/\u003E\u003Cstrong\u003E404-894-2906\u003C\/strong\u003E","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}