{"549371":{"#nid":"549371","#data":{"type":"news","title":"Georgia Tech Professor Rao Tummala to Present Keynote at the 2016 International Wafer-Level Packaging Conference","body":[{"value":"\u003Cp\u003EThe SMTA and \u003Cem\u003EChip Scale Review\u003C\/em\u003E magazine have announced that The Georgia Institute of Technology, School of Electrical and Computer Engineering Professor, Dr. Rao Tummala, will present a keynote lecture at the 2016 International Wafer-Level Packaging Conference (IWLPC), on October 19 in San Jose, CA.\u003C\/p\u003E\u003Cp\u003ETitled \u0022Promise and Future of Embedding and Fan-Out Technologies,\u201d Prof. Tummala\u2019s speech will touch upon the two types packaging strategies, wafer-level packaging (WLP) with embedded ICs with limited external I\/O connections, and fan-out technology (eWLP) that eliminates these I\/O limitations. He will also talk about two other alternatives such as panel level fan out with chip-first and chip-last options. This presentation will describe the promise and future of embedding and fan-out technologies in relation to package size, thickness, interconnect length, I\u0027O pitch and production costs.\u003C\/p\u003E\u003Cp\u003EProf. Rao Tummala is a Distinguished and Endowed Professor Chair at Georgia Tech. He is well known as an industrial technologist, technology pioneer, and educator. He is the father of LTCC and many System-on-Package Technologies.\u003C\/p\u003E\u003Cp\u003EInterconnecting Wafer-Level packaging, 3D, and manufacturing, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. IWLPC brings together some of the semiconductor industry\u0027s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.\u0026nbsp; \u003Ca href=\u0022http:\/\/www.iwlpc.com\/\u0022\u003EMore about the conference here\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E- Christa Ernst\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"The Georgia Institute of Technology, School of Electrical and Computer Engineering Professor, Dr. Rao Tummala, will present a keynote lecture at the 2016 International Wafer-Level Packaging Conference (IWLPC), on October 19 in San Jose, CA."}],"uid":"27863","created_gmt":"2016-06-30 09:02:06","changed_gmt":"2016-10-08 03:22:00","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-06-30T00:00:00-04:00","iso_date":"2016-06-30T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"549361":{"id":"549361","type":"image","title":"Rao Tummala","body":null,"created":"1467320400","gmt_created":"2016-06-30 21:00:00","changed":"1475895343","gmt_changed":"2016-10-08 02:55:43","alt":"Rao Tummala","file":{"fid":"218150","name":"rt_500x500.png","image_path":"\/sites\/default\/files\/images\/rt_500x500_0.png","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/rt_500x500_0.png","mime":"image\/png","size":557011,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/rt_500x500_0.png?itok=h-g_xCit"}}},"media_ids":["549361"],"groups":[{"id":"1271","name":"NanoTECH"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"133","name":"Special Events and Guest Speakers"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"170440","name":"3D Integrated Systems"},{"id":"136711","name":"3D Packaging"},{"id":"170441","name":"Advanced Semiconductor Manufacturing"},{"id":"172177","name":"device packaging"},{"id":"170442","name":"embedded ICs"},{"id":"2557","name":"mems"},{"id":"12103","name":"Rao Tummala"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"166868","name":"the Georgia Electronic Design Center"},{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"168357","name":"The School of Materials Science and Engineering"},{"id":"170443","name":"Wafer-Level Packaging Conference"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["christa.ernst@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}