{"543351":{"#nid":"543351","#data":{"type":"news","title":"The GT 3D Systems Packaging Research Center (PRC) Announces the \u0022New Era of Automotive Electronics (NAE)\u0022 Industry\/Academic Consortium at its Spring Partnership Meeting","body":[{"value":"\u003Cp\u003EThe Georgia Tech 3D Systems Packaging Research Center (PRC) hosted its bi-annual industry partnership meeting on May 25-27, 2016 with its 50 member companies.\u003C\/p\u003E\u003Cp\u003EDuring the event, the Georgia Tech PRC faculty and students reviewed their current industry programs and proposed to launch a large- scale industry consortium centered on a New era of Automotive Electronics (NAE) that includes advances in computing and communication electronics for centralized or distributed computing as well as sensing electronics for autonomous driving and high power and high-temperature electronics for electric cars.\u003C\/p\u003E\u003Cp\u003EThe newly formed consortium will involve a 100 person co- development R\u0026amp;D team that includes 20 Georgia Tech Faculty, 30 Ph.D. and M.S. students, and 50 industry engineers who are integrated into one of the above three R\u0026amp;D focus areas.\u003C\/p\u003E\u003Cp\u003ECompanies newly joining the PRC automotive\u0026nbsp;industry consortium\u0026nbsp;are Tier 1, Tier 2 and OEMs\u0026nbsp; from the US, Germany, France, Japan and Korea.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;For further details, please contact Prof. Rao Tummala, \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"The Georgia Tech 3D Systems Packaging Research Center (PRC) hosted its bi-annual industry partnership meeting on May 25-27, 2016 with its 50 member companies."}],"uid":"27863","created_gmt":"2016-06-09 10:31:18","changed_gmt":"2016-10-08 03:21:53","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-06-09T00:00:00-04:00","iso_date":"2016-06-09T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"543341":{"id":"543341","type":"image","title":"GT PRC 2016 Spring IAB Meeting","body":null,"created":"1465826400","gmt_created":"2016-06-13 14:00:00","changed":"1475895333","gmt_changed":"2016-10-08 02:55:33","alt":"GT PRC 2016 Spring IAB Meeting","file":{"fid":"217183","name":"slide0.png","image_path":"\/sites\/default\/files\/images\/slide0.png","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/slide0.png","mime":"image\/png","size":1009071,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/slide0.png?itok=q8NHwgHy"}}},"media_ids":["543341"],"groups":[{"id":"1271","name":"NanoTECH"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"133","name":"Special Events and Guest Speakers"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"168580","name":"Automotive Electronics"},{"id":"170362","name":"automotive sensors"},{"id":"170363","name":"Industry Advisory Board Meeting"},{"id":"73111","name":"industry engagement"},{"id":"12103","name":"Rao Tummala"},{"id":"172112","name":"research consortium"},{"id":"166968","name":"the Institute for Electronics and Nanotechnology"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"},{"id":"39541","name":"Systems"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["christa.ernst@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}