{"521701":{"#nid":"521701","#data":{"type":"event","title":"IEN Technical Seminar on Advanced Fabrication: Dielectrics for ICs and Packaging: Materials Used Today and Future Prospects","body":[{"value":"\u003Cp align=\u0022center\u0022\u003E\u003Cstrong\u003EPaul A. Kohl, Hercules, Inc. \/Thomas L. Gossage Chair and Regents\u2019 Professor\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology, Chemical and Biomolecular Engineering\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EAbstract:\u003C\/strong\u003E Dielectric materials (i.e. insulators) provide critical functions throughout the\u003Cbr \/\u003Epackaging hierarchy, including on-chip dielectrics, package substrates, and printed wiring\u003Cbr \/\u003Eboards. In this presentation, the role of dielectrics, their critical properties, and the type of\u003Cbr \/\u003Ematerials at each level of packaging will be reviewed. Of particular interest is the need for\u003Cbr \/\u003Eimproved dielectrics in packaging- the dielectric in chip substrates and printed wiring boards.\u003Cbr \/\u003EThe scaling of transistors to smaller dimensions requires that on-chip and off-chip dielectrics\u003Cbr \/\u003Eoperate at higher frequency, lower-voltage and less energy loss. This needs to be achieved\u003Cbr \/\u003Ewith improved packing density (smaller features) and at low-cost. The status of existing\u003Cbr \/\u003Ematerials and the challenges they face will be reviewed.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EBio Sketch:\u003C\/strong\u003E Paul Kohl received a Ph.D. from The University of Texas, in Chemistry in 1978. After\u003Cbr \/\u003Egraduation, Dr. Kohl was employed at AT\u0026amp;T Bell Laboratories in Murray Hill, NJ from 1978 to\u003Cbr \/\u003E1989. During that time, he was involved in new chemical processes for silicon and compound\u003Cbr \/\u003Esemiconductor devices and their packaging. In 1989, he joined the faculty of the Georgia\u003Cbr \/\u003EInstitute of Technology in the School of Chemical and Biomolecular Engineering, where he is\u003Cbr \/\u003Ecurrently a Regents\u2019 Professor and holder of the Hercules Inc. \/Thomas L. Gossage Chair. Dr.\u003Cbr \/\u003EKohl\u2019s research interests include new materials and processes for advanced interconnects\u003Cbr \/\u003Efor integrated circuits, and electrochemical energy devices for energy conversion and\u003Cbr \/\u003Estorage. He has 250 journal publication, 63 US patents, and more than 400 conference\u003Cbr \/\u003Epresentations. Dr. Kohl is the past Editor of the Journal of The Electrochemical Society and\u003Cbr \/\u003EElectrochemical and Solid-State Letter, past Director of the MARCO Interconnect Focus\u003Cbr \/\u003ECenter, and past President of the Electrochemical Society.\u003C\/p\u003E\u003Cp align=\u0022center\u0022\u003EPizza lunch will be provided, however we ask that you limit yourself to two slices\u003Cbr \/\u003Eso that all attendees are accommodated.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EDielectric materials (i.e. insulators) provide critical functions throughout the\u003Cbr \/\u003Epackaging hierarchy, including on-chip dielectrics, package substrates, and printed wiring\u003Cbr \/\u003Eboards. In this presentation, the role of dielectrics, their critical properties, and the type of\u003Cbr \/\u003Ematerials at each level of packaging will be reviewed. Of particular interest is the need for\u003Cbr \/\u003Eimproved dielectrics in packaging- the dielectric in chip substrates and printed wiring boards.\u003Cbr \/\u003EThe scaling of transistors to smaller dimensions requires that on-chip and off-chip dielectrics\u003Cbr \/\u003Eoperate at higher frequency, lower-voltage and less energy loss. This needs to be achieved\u003Cbr \/\u003Ewith improved packing density (smaller features) and at low-cost. The status of existing\u003Cbr \/\u003Ematerials and the challenges they face will be reviewed.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"In this presentation, the role of dielectrics, their critical properties, and the type of materials at each level of packaging will be reviewed."}],"uid":"27863","created_gmt":"2016-04-05 11:01:08","changed_gmt":"2016-10-08 02:17:21","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2016-04-14T13:00:00-04:00","event_time_end":"2016-04-14T14:00:00-04:00","event_time_end_last":"2016-04-14T14:00:00-04:00","gmt_time_start":"2016-04-14 17:00:00","gmt_time_end":"2016-04-14 18:00:00","gmt_time_end_last":"2016-04-14 18:00:00","rrule":null,"timezone":"America\/New_York"},"extras":["free_food"],"groups":[{"id":"1271","name":"NanoTECH"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"213771","name":"The Center for MEMS and Microsystems Technologies"},{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[],"keywords":[{"id":"136861","name":"dielectric"},{"id":"114491","name":"dielectric materials"},{"id":"168534","name":"IC packaging"},{"id":"107","name":"Nanotechnology"},{"id":"77031","name":"PWB"},{"id":"168535","name":"substrates"},{"id":"168536","name":"the Institue for Materials"},{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"166974","name":"the School of Chemical and Biomolecular Engineering"},{"id":"168380","name":"the School of Electrical and Computer Engineering"},{"id":"168357","name":"The School of Materials Science and Engineering"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1795","name":"Seminar\/Lecture\/Colloquium"}],"invited_audience":[{"id":"78761","name":"Faculty\/Staff"},{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EDr. Hang Chen: \u003Ca href=\u0022mailto:hang.chen@ien.gatech.edu\u0022\u003Ehang.chen@ien.gatech.edu\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":[],"slides":[],"orientation":[],"userdata":""}}}