{"517101":{"#nid":"517101","#data":{"type":"news","title":"Swaminathan Chosen for IEEE CPMT Best Paper Award","body":[{"value":"\u003Cp\u003EMadhavan Swaminathan has been chosen for a 2015 Best Paper Award from the \u003Cem\u003EIEEE Transactions on Components, Packaging, and Manufacturing Technology\u003C\/em\u003E\u0026nbsp;in the category of Electrical Performance of Integrated Systems. Swaminathan is a professor in the Georgia Tech School of Electrical and Computer Engineering, where he holds the John Pippin Chair in Electromagnetics and leads the Mixed Signal Design Group. \u0026nbsp;\u003C\/p\u003E\u003Cp\u003ESwaminathan shares this award with his coauthors KiJin Han, who is his former Ph.D. student and is now an assistant professor at UNIST in South Korea, and Jongwoo Jeong, who is Han\u2019s Ph.D. student at UNIST. They will be presented with this honor at the 66th IEEE Electronic Components and Technology Conference, to be held May 31-June 3 in Las Vegas, Nevada.\u003C\/p\u003E\u003Cp\u003EThe title of the award-winning paper is \u201cModeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects.\u201d Extracting the parasitics of Through Silicon Vias in 3D integrated circuits is a challenging problem. These effects are affected by the bias voltage applied to the silicon substrate and finite substrate dimensions. Hence, analytical models that have been used in the past have significant error associated with them.\u003C\/p\u003E\u003Cp\u003EIn this work, Swaminathan and his colleagues use the conduction mode basis functions originally derived to model current and charge and modify them by incorporating depletion capacitance. To account for the finite substrate dimensions, multi-layered Green\u2019s function with suitable approximations are used. The method developed has been applied to both simple examples to show accuracy and to TSV arrays to show computational efficiency.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Professor\u0026nbsp;Madhavan Swaminathan has been chosen for a 2015 Best Paper Award from the\u0026nbsp;\u003Cem\u003EIEEE Transactions on Components, Packaging, and Manufacturing Technology\u003C\/em\u003E.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Professor Madhavan Swaminathan has been chosen for a 2015 Best Paper Award from the IEEE Transactions on Components, Packaging, and Manufacturing Technology."}],"uid":"27241","created_gmt":"2016-03-24 13:29:20","changed_gmt":"2016-10-08 03:21:09","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-03-24T00:00:00-04:00","iso_date":"2016-03-24T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"301341":{"id":"301341","type":"image","title":"Madhavan Swaminathan","body":null,"created":"1449244572","gmt_created":"2015-12-04 15:56:12","changed":"1475895004","gmt_changed":"2016-10-08 02:50:04","alt":"Madhavan Swaminathan","file":{"fid":"199552","name":"madhavanswaminathan131021br459_web.jpg","image_path":"\/sites\/default\/files\/images\/madhavanswaminathan131021br459_web_0.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/madhavanswaminathan131021br459_web_0.jpg","mime":"image\/jpeg","size":4110863,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/madhavanswaminathan131021br459_web_0.jpg?itok=g8XTDiKC"}}},"media_ids":["301341"],"related_links":[{"url":"http:\/\/www2.ece.gatech.edu\/research\/labs\/hppdl\/Epsilon2010\/index.html","title":"Georgia Tech Mixed Signal Design Group"},{"url":"https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/madhavan-swaminathan","title":"Madhavan Swaminathan"},{"url":"http:\/\/www.ece.gatech.edu\/","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/ieeexplore.ieee.org\/xpl\/RecentIssue.jsp?punumber=5503870","title":"IEEE Transactions on Components, Packaging, and Manufacturing Technology"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"171850","name":"and Manutacturing Technology Society"},{"id":"109","name":"Georgia Tech"},{"id":"128621","name":"IEEE Components"},{"id":"24251","name":"Madhavan Swaminathan"},{"id":"4187","name":"packaging"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"171851","name":"through-silicon via interposer"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\u003Cp\u003E404-894-2906\u003C\/p\u003E","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}