Committee: 

Dr. Tummala, Advisor 

Dr. Ralph, Chair

Dr. Chang

Dr. Sundaram

Abstract: The objective of the proposed research is to develop low loss and high tolerance out-of-plane optical interconnections between single-mode optical fibers and photonic devices in an ultra-thin glass interposer. The key challenges and unique approaches to address them are as follows: a) Mode-matched out-of-plane optical interconnections to address high optical loss. b) High tolerance alignment structures to allow low cost passive optical fiber assembly. c) High throughput parallel processes to simplify integration complexity. As bandwidth requirement continues to increase, the bottleneck to higher performance computing is in the communication between chips. Optical interconnections have unchallenged bandwidth capacity comparing to electrical, but the scaling of optoelectronic modules have proven difficult due to the high cost and high loss of optical interconnections at package level.