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  <title><![CDATA[Ph.D. Proposal Oral Exam - Soonyoung Cha]]></title>
  <body><![CDATA[<p><strong>Title:&nbsp; </strong><em>Frontend Reliability Analysis and Modeling from Device to Integrated Circuits</em></p><p><strong>Committee:&nbsp; </strong></p><p>Dr. Milor, Advisor&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</p><p>Dr. Keezer, Chair</p><p>Dr. Naeemi</p><p><strong>Abstract: </strong>The objective of this research is to extract NBTI and GOBD model parameters to enable the estimation of the remaining life of individual chips.&nbsp; For the parameter extraction, the device-level models of both reliability mechanisms are modelled with the RTN model.&nbsp; The ability to predict a lifetime enables the optimization of timing guardbands or circuit adaptation based on a prediction of the increase in delay as a function of time, temperature, and usage.&nbsp; The proposed approach involves the use of measurements of variation in the ground, power supply, and I/O signals.&nbsp; These measurements are linked to not only extract model parameters but also estimate the remaining lifetime of ICs accurately.</p>]]></body>
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