{"469781":{"#nid":"469781","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Kaya Demir","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EReliability Studies of Ultra-small Copper-plated Through-package-vias in Ultra-thin Glass Interposers\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECommittee:\u0026nbsp; \u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EDr. Tummala, , Advisor\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EDr. Degertekin, Chair\u003C\/p\u003E\u003Cp\u003EDr. Brand\u003C\/p\u003E\u003Cp\u003EDr. Pucha\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003EThe objective of the proposed research is to model and design copper-plated through package vias, leading to fabrication of test vehicles for characterization of defects, and validation of models by demonstration of reliability through accelerated lifetime testing. \u0026nbsp;The need for higher and higher bandwidth will continue to scale-down the TPV pitch. In addition, glass thicknesses and via-hole diameters can be reduced to improve I\/O density and shorter interconnect length, further aggravating the reliability concerns. Additionally, the probability of failure of a package increases as the number of TPVs increase. Therefore, a comprehensive approach starting from TPV modeling, design, leading to process development and fabrication is required to realize reliable TPV structures. This forms the key focus of this thesis.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"ECE Proposal Oral Exam"}],"uid":"28475","created_gmt":"2015-11-15 12:33:05","changed_gmt":"2016-10-08 02:14:50","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2015-11-16T18:00:00-05:00","event_time_end":"2015-11-16T18:00:00-05:00","event_time_end_last":"2015-11-16T18:00:00-05:00","gmt_time_start":"2015-11-16 23:00:00","gmt_time_end":"2015-11-16 23:00:00","gmt_time_end_last":"2015-11-16 23:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"1808","name":"graduate students"},{"id":"102851","name":"Phd proposal"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}