The two topics on which he will lecture are “Emerging Interconnection Architectures and Technologies” and “Heterogeneous System Design and Integration.”

Bakir has been a member of the ECE faculty since 2010. He directs the Integrated 3D Systems Group, where he and his team explore the design, fabrication, and characterization of 3D electronic systems and advanced interconnect networks. They focus on the (co)design, fabrication, and characterization of chip-level electrical, optical, and thermal interconnect networks to solve the power delivery, off-chip signaling, and cooling needs of future many-core and memory 3D integrated systems.

The IEEE CPMT Distinguished Lecturer Program aims to serve communities interested in the scientific, engineering, and production aspects of materials, component parts, modules, hybrids, and microelectronic systems for all electronic applications.