Wednesday, November 5th – Friday, November 7th

Global Learning Center at the Georgia Institute of Technology
84 Fifth Street, NW Atlanta, Georgia 30332 USA

 The GIT 2014 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.

Plenary Panel Session: Interposer Technologies and Manufacturing Infrastructure

GIT 2014 Technical Sessions

• Glass Interposers
• System Integration with Interposers
• Panel Mfg. Infrastructure – Tools and Materials
• Design and Design Tools: Electrical, Thermal, and Mechanical Design
• Organic and WLFO Interposers 
• Interposers for RF and Power

Over 38 guest lecturers from all sectors of the packaging supply chain.

Keynote and Invited Speakers include:

• Daniel Berger, IBM
• D.C. Hu, Unimicron
• M. Okuyama NGK NTK
• M. Gingerella, SUSS
• Reona Nakamura, Mitsubishi Electric
• R. Sprengard, SCHOTT
• F. Carbolante, Qualcomm
• And many others

GIT 2014 will close with the GIT Golf Classic
Saturday, November 8^th, Reynolds Plantation Greensboro, Georgia  30642 USA