{"266131":{"#nid":"266131","#data":{"type":"news","title":"Thadesar to Receive Outstanding Paper Award at IEEE ECTC 2014","body":[{"value":"\u003Cp\u003EParagkumar Thadesar has been named the recipient of the Outstanding Poster Paper Award from the IEEE 63rd Electronic Components and Technology Conference (ECTC), held last May in Las Vegas. A Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE), Thadesar and ECE Associate Professor Muhannad Bakir will be presented with this honor at the IEEE 64\u003Csup\u003Eth\u003C\/sup\u003E ECTC to be held in Orlando May 27-30; Bakir was a coauthor on the paper and serves as Thadesar\u0027s Ph.D. advisor.\u003C\/p\u003E\u003Cp\u003EThe title of the award-winning paper is \u201cFabrication and Characterization of Novel Photodefined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers.\u201d Silicon interposers\u0026nbsp;with high-density metallization\u0026nbsp;help\u0026nbsp;support multiple silicon chips atop with high bandwidth-density communication between the chips, and consequently, they help obtain compact integrated circuit (IC) systems. As a result, silicon interposers\u0026nbsp;have been widely explored by both the semiconductor industry and academia for a wide range of applications from mobile phones to high-performance computing in supercomputers and data centers.\u0026nbsp;State-of-the-art vertical metal interconnections,\u0026nbsp;also known as\u0026nbsp;through-silicon vias (TSVs), help connect chips atop a silicon interposer to an organic substrate below the interposer. However, these state-of-the-art TSVs exhibit a large electrical loss, which becomes a concern at higher frequencies.\u003C\/p\u003E\u003Cp\u003ETo address this challenge, Paragkumar and Bakir designed, fabricated, and characterized photodefined polymer-embedded vias with copper vias within polymer wells in silicon. It is a unique vertical metal interconnection technology with the fabrication ease of silicon interposers and the electrical advantages of competing glass interposers. The polymer-embedded vias\u0026nbsp;promise approximately 80 percent reduction in TSV insertion loss\u0026nbsp;at 50 GHz\u0026nbsp;compared to the state-of-the-art TSVs with similar dimensions.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student Paragkumar Thadesar has has been named the recipient of the Outstanding Poster Paper Award from the IEEE 63rd Electronic Components and Technology Conference (ECTC), held last May in Las Vegas.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Ph.D. student Paragkumar Thadesar has has been named the recipient of the Outstanding Poster Paper Award from the IEEE 63rd Electronic Components and Technology Conference (ECTC), held last May in Las Vegas."}],"uid":"27241","created_gmt":"2014-01-10 19:04:31","changed_gmt":"2016-10-08 03:15:40","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-01-13T00:00:00-05:00","iso_date":"2014-01-13T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"243791":{"id":"243791","type":"image","title":"Paragkumar Thadesar","body":null,"created":"1449243704","gmt_created":"2015-12-04 15:41:44","changed":"1475894919","gmt_changed":"2016-10-08 02:48:39","alt":"Paragkumar Thadesar","file":{"fid":"197860","name":"parag_for_article.jpg","image_path":"\/sites\/default\/files\/images\/parag_for_article_0.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/parag_for_article_0.jpg","mime":"image\/jpeg","size":5415660,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/parag_for_article_0.jpg?itok=7FkbRtKi"}}},"media_ids":["243791"],"related_links":[{"url":"http:\/\/www.ece.gatech.edu\/","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/www.ece.gatech.edu\/research\/labs\/i3ds\/","title":"Integrated 3D Systems Group"},{"url":"http:\/\/www.ectc.net\/","title":"IEEE ECTC 2014"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"8862","name":"Student Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"109","name":"Georgia Tech"},{"id":"83441","name":"IEEE Electronic Components and Technology Conference"},{"id":"12093","name":"Muhannad Bakir"},{"id":"83431","name":"Paragkumar Thadesar"},{"id":"166855","name":"School of Electrical and Computer Engineering"}],"core_research_areas":[{"id":"39431","name":"Data Engineering and Science"},{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\u003Cp\u003E404-894-2906\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jackie.nemeth@ece.gatech.edu\u0022\u003Ejackie.nemeth@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}