{"244811":{"#nid":"244811","#data":{"type":"news","title":"Global Semiconductor and System Technology Leaders to Debate Future of Electronics for Smart Systems, R\u0026D and Manufacturing at GIT 2013 - November 18-20","body":[{"value":"\u003Cp\u003EYou are cordially invited to the\u003Cstrong\u003E\u003Ca href=\u0022http:\/\/www.prc.gatech.edu\/git2013\/\u0022\u003E GIT 2013 Workshop\u003C\/a\u003E\u003C\/strong\u003E, sponsored by IEEE, is intended to stimulate the development of the most advanced semiconductor and systems packaging\u0026nbsp;technologies, with interposer experts comparing and contrasting a wide variety of interposer technologies such as silicon, organic, and glass.\u003C\/p\u003E\u003Cp\u003EGIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. These leading-edge interposer technologies have many applications including in the packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive and high performance systems.\u003C\/p\u003E\u003Cp\u003EGIT 2013 will focus on Interposer Technology with an expanded 2 1\/2-day agenda including:\u003C\/p\u003E\u003Cp\u003E* Plenary Talks from Industry and Academic Experts\u003C\/p\u003E\u003Cp\u003E* Technical Sessions\u003C\/p\u003E\u003Cp\u003E* Interactive Poster Session (Best Poster Paper Awards)\u003C\/p\u003E\u003Cp\u003E* Networking Reception\u003C\/p\u003E\u003Cp\u003EGIT 2013 Kicks off Sunday, November 17 with The \u003Cstrong\u003E\u003Ca href=\u0022http:\/\/www.prc.gatech.edu\/git2013\/golf.html\u0022\u003E1st Annual GIT Golf Classic\u003C\/a\u003E\u003C\/strong\u003E at the Landing Course, Reynolds Plantation, Greensboro, Georgia,\u0026nbsp;\u003Cem\u003E\u0022The Landing is the hidden gem of Lake Oconee. Bob Cupp\u0027s architectural genius was unveiled to the golfing world during the construction of Reynolds Landing. From the masterful green settings to the challenging shots played around beautiful Lake Oconee, The Landing is clearly one of Georgia\u0027s finest kept secrets.\u0022\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003ECosts include: Transportation to and from the Georgia Tech Learning Center, greens fees, timed starts, and brunch. Best ball and longest drive awards will be recognized for the day!\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"The Global Interposer Technology 2013 Workshop (GIT 2013), sponsored by IEEE, brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world."}],"uid":"27863","created_gmt":"2013-10-14 08:29:22","changed_gmt":"2016-10-08 03:15:09","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-10-14T00:00:00-04:00","iso_date":"2013-10-14T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"245101":{"id":"245101","type":"image","title":"GIT 2013 Logo Sm","body":null,"created":"1449243722","gmt_created":"2015-12-04 15:42:02","changed":"1475894921","gmt_changed":"2016-10-08 02:48:41","alt":"GIT 2013 Logo Sm","file":{"fid":"197894","name":"git_2013_logo_sm.jpg","image_path":"\/sites\/default\/files\/images\/git_2013_logo_sm_0.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/git_2013_logo_sm_0.jpg","mime":"image\/jpeg","size":34444,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/git_2013_logo_sm_0.jpg?itok=4fhxFR8B"}}},"media_ids":["245101"],"groups":[],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"42941","name":"Art Research"},{"id":"133","name":"Special Events and Guest Speakers"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"76491","name":"Global Interposer Workshop"},{"id":"76501","name":"IEEE Conference"},{"id":"76521","name":"IEEE Invited Speaker Series"},{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"76511","name":"interconnections"},{"id":"69571","name":"Interposers"},{"id":"4187","name":"packaging"},{"id":"167686","name":"Semiconductors"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["git2013@prc.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}