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  <title><![CDATA[Registration Opens for GIT 2013]]></title>
  <body><![CDATA[<p><strong>GIT 2013 </strong>brings together academic and industry researchers and technology developers, users, and manufacturers from around the world. Advanced interposer technologies have many applications including packaging of&nbsp; ICs in&nbsp; 2D, 2.5D and 3D&nbsp; from smart phones to automotive applications as well as in high performance systems. GIT 2013 has&nbsp;3-day agenda including:</p><p>* Plenary talks from Industry and Academic experts<br /> * Technical Sessions<br /> * Interactive Poster Session<br /> * Networking Reception</p><p>Register at: <a href="http://www.prc.gatech.edu/git2013/index.html" title="http://www.prc.gatech.edu/git2013/index.html">http://www.prc.gatech.edu/git2013/index.html</a></p>]]></body>
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      <value><![CDATA[The Global Interposer Technology (GIT) 2013 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging  technologies.]]></value>
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      <value><![CDATA[2013-11-16T23:00:00-05:00]]></value>
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      <timezone><![CDATA[America/New_York]]></timezone>
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      <value><![CDATA[Fee Varies]]></value>
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      <url><![CDATA[http://www.prc.gatech.edu/git2013/index.html]]></url>
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          <item><![CDATA[Institute for Electronics and Nanotechnology]]></item>
          <item><![CDATA[3D Systems Packaging Research Center]]></item>
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