Georgia Tech researchers Muhannad Bakir, Andrei Fedorov, Yogendra Joshi and Suresh Sitaraman are developing three-dimensional chip cooling technology that will be able to handle heat loads as much as ten times greater than systems commonly used today. (Georgia Tech Photo: Gary Meek)

Additional Information

Groups

Research Horizons

Categories

Engineering, Military Technology, Nanotechnology and Nanoscience

Keywords

3-D microsystems, cooling, darpa, heat dissipation

Status

• Created By: John Toon
• Workflow Status: Published
• Created On: Dec 3, 2015 - 4:59pm
• Last Updated: Oct 7, 2016 - 10:47pm