{"120471":{"#nid":"120471","#data":{"type":"event","title":"3D Systems Packaging Research Center Seminar","body":[{"value":"\u003Cp\u003EAnandh Subramaniam, professor of materials science and engineering from the Indian Institute of Technology at Kanpur will deliver a seminar entitled \u0022Critical Thickness for Formation of Interfacial Misfit Dislocations in Epitaxial Semiconductor Systems.\u0022\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EAbout the Speaker\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EAnandh Subramaniam earned his B.Tech from IIT Madras, followed by a M.E and Ph.D from I.I.Sc., Bangalore. Then he was a scientist in CSIR followed by the position of a Guest Scientist at Max Planck Institute for Metals Research at Stuttgart (as a Max Planck Fellow and as an Alexander von Humboldt Fellow).\u003C\/p\u003E\u003Cp\u003EA flyer with more detailed talk and biographical information is provided below.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Anandh Subramaniam, materials science and engineering professor from IIT-Kanpur will speak on April 3."}],"uid":"27241","created_gmt":"2012-03-29 09:20:40","changed_gmt":"2016-10-08 01:58:33","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2012-04-03T16:00:00-04:00","event_time_end":"2012-04-03T17:00:00-04:00","event_time_end_last":"2012-04-03T17:00:00-04:00","gmt_time_start":"2012-04-03 20:00:00","gmt_time_end":"2012-04-03 21:00:00","gmt_time_end_last":"2012-04-03 21:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"related_files":{"248716":{"fid":null,"name":"Katie Owens","file_path":"\/sites\/default\/files\/images\/16x9%20cassidy_3.jpeg","file_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/16x9%20cassidy_3.jpeg","mime":"image\/jpeg","size":346061,"description":null}},"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[],"keywords":[],"core_research_areas":[],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\u003Cp\u003E3D Systems Packaging Research Center\u003C\/p\u003E\u003Cp\u003E404.894.9097\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":[],"slides":[],"orientation":[],"userdata":""}}}