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  <created>1789054209</created>
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  <title><![CDATA[Chip-under-strain_Fast-and-Curious_cream-background.jpeg]]></title>
      <body><![CDATA[<div><div><div><div><div><div><p>Applying&nbsp;mechanical&nbsp;strain&nbsp;to&nbsp;semiconductor&nbsp;devices&nbsp;can&nbsp;improve&nbsp;the&nbsp;flow&nbsp;of&nbsp;electrons,&nbsp;enabling&nbsp;faster&nbsp;and&nbsp;more&nbsp;energy-efficient&nbsp;computing.&nbsp;<em>Image&nbsp;above&nbsp;is&nbsp;not&nbsp;a&nbsp;depiction&nbsp;of&nbsp;an&nbsp;actual&nbsp;device&nbsp;or&nbsp;experimental&nbsp;result.</em></p></div></div></div></div></div></div>]]></body>
    <alt><![CDATA[Flexible electronic device with a dense array of interconnects bends under mechanical strain, demonstrating stretchable semiconductor packaging and advanced flexible electronics technology.]]></alt>
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      <alt><![CDATA[Flexible electronic device with a dense array of interconnects bends under mechanical strain, demonstrating stretchable semiconductor packaging and advanced flexible electronics technology.]]></alt>
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          <item><![CDATA[Matter and Systems]]></item>
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