{"677375":{"#nid":"677375","#data":{"uid":"36172","author":"dwatson71","created_gmt":"2025-07-09 18:43:58","changed_gmt":"2025-07-09 18:43:58","title":"25-2304-Darpa-Happi-Ali-Adibi-007.JPG","body":[{"value":"\u003Cp\u003ESilicon-on-insulator (SOI) wafer used in a multi-chip module featuring 3D optical interconnects. \u003Cem\u003E(Photo: Allison Carter)\u003C\/em\u003E\u003C\/p\u003E","format":"limited_html"}],"image":{"alt":"Photo of Silicon-on-insulator (SOI) wafer","view":{"#theme":"field","#title":"Image","#label_display":"hidden","#view_mode":"image_740","#language":"en","#field_name":"field_image","#field_type":"image","#field_translatable":false,"#entity_type":"media","#bundle":"image","#object":{},"#items":{},"#formatter":"image","#is_multiple":false,"#third_party_settings":[],"0":{"#theme":"image_formatter","#item":{},"#item_attributes":[],"#image_style":"large","#url":null,"#cache":{"tags":["config:image.style.large","file:261269"],"contexts":[],"max-age":-1}},"#cache":{"contexts":[],"tags":[],"max-age":-1},"#weight":0},"file":{"fid":"261269","name":"25-2304-Darpa-Happi-Ali-Adibi-007.JPG","path":"\/sites\/default\/files\/2025\/07\/09\/25-2304-Darpa-Happi-Ali-Adibi-007.JPG","fullpath":"\/var\/www\/html\/files\/public\/2025\/07\/09\/25-2304-Darpa-Happi-Ali-Adibi-007.JPG","mime":"image\/jpeg","size":1306660}},"groups":[{"id":"1188","name":"Research Horizons"},{"id":"1255","name":"School of Electrical and Computer Engineering"}],"keywords":[]}}}