{"606315":{"#nid":"606315","#data":{"uid":"34728","author":"cheath6","created_gmt":"2018-05-18 18:34:29","changed_gmt":"2018-05-18 18:34:29","title":"Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films","body":[],"image":{"alt":"Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films","view":{"#theme":"field","#title":"Image","#label_display":"hidden","#view_mode":"image_740","#language":"en","#field_name":"field_image","#field_type":"image","#field_translatable":false,"#entity_type":"media","#bundle":"image","#object":{},"#items":{},"#formatter":"image","#is_multiple":false,"#third_party_settings":[],"0":{"#theme":"image_formatter","#item":{},"#item_attributes":[],"#image_style":"large","#url":null,"#cache":{"tags":["config:image.style.large","file:231246"],"contexts":[],"max-age":-1}},"#cache":{"contexts":[],"tags":[],"max-age":-1},"#weight":0},"file":{"fid":"231246","name":"Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films.jpg","path":"\/sites\/default\/files\/images\/Figure%204.%20%20All-Cu%20die-attach%20joints%20formed%20after%20densification%20of%20patterned%20nano-Cu%20foam%20films.jpg","fullpath":"\/var\/www\/html\/files\/public\/images\/Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films.jpg","mime":"image\/jpeg","size":97680}},"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"}],"keywords":[]}}}