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  <title><![CDATA[Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and ]]></title>
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    <alt><![CDATA[Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and ]]></alt>
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      <alt><![CDATA[Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and ]]></alt>
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          <item><![CDATA[3D Systems Packaging Research Center]]></item>
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