<node id="606311">
  <nid>606311</nid>
  <type>image</type>
  <uid>
    <user id="34728"><![CDATA[34728]]></user>
  </uid>
  <created>1526666782</created>
  <changed>1526668178</changed>
  <title><![CDATA[Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB]]></title>
      <body><![CDATA[ ]]></body>
    <alt><![CDATA[Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB]]></alt>
  <field_image>
    <item>
      <fid><![CDATA[231242]]></fid>
      <filename><![CDATA[Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB;.png]]></filename>
      <filepath><![CDATA[]]></filepath>
      <filemime><![CDATA[image/png]]></filemime>
      <filesize><![CDATA[93986]]></filesize>
      <alt><![CDATA[Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB]]></alt>
    </item>
  </field_image>
  <og_groups>
          <item>213791</item>
      </og_groups>
  <og_groups_both>
          <item><![CDATA[3D Systems Packaging Research Center]]></item>
      </og_groups_both>
</node>
