{"605091":{"#nid":"605091","#data":{"uid":"34728","author":"cheath6","created_gmt":"2018-04-13 18:06:09","changed_gmt":"2018-04-13 18:06:09","title":"Figure 6. First Ever 2.5D GPE package at 40um I\/O pitch ","body":[],"image":{"alt":"","view":{"#theme":"field","#title":"Image","#label_display":"hidden","#view_mode":"image_740","#language":"en","#field_name":"field_image","#field_type":"image","#field_translatable":false,"#entity_type":"media","#bundle":"image","#object":{},"#items":{},"#formatter":"image","#is_multiple":false,"#third_party_settings":[],"0":{"#theme":"image_formatter","#item":{},"#item_attributes":[],"#image_style":"large","#url":null,"#cache":{"tags":["config:image.style.large","file:230699"],"contexts":[],"max-age":-1}},"#cache":{"contexts":[],"tags":[],"max-age":-1},"#weight":0},"file":{"fid":"230699","name":"Picture6GPE.png","path":"\/sites\/default\/files\/images\/Picture6GPE.png","fullpath":"\/var\/www\/html\/files\/public\/images\/Picture6GPE.png","mime":"image\/png","size":85160}},"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"}],"keywords":[]}}}