{"604422":{"#nid":"604422","#data":{"uid":"27863","author":"Christa Ernst","created_gmt":"2018-03-29 13:49:13","changed_gmt":"2018-03-29 13:49:13","title":"5G Modules Raj","body":[],"image":{"alt":"Figure 5: 5G Modules from large glass panels","view":{"#theme":"field","#title":"Image","#label_display":"hidden","#view_mode":"image_740","#language":"en","#field_name":"field_image","#field_type":"image","#field_translatable":false,"#entity_type":"media","#bundle":"image","#object":{},"#items":{},"#formatter":"image","#is_multiple":false,"#third_party_settings":[],"0":{"#theme":"image_formatter","#item":{},"#item_attributes":[],"#image_style":"large","#url":null,"#cache":{"tags":["config:image.style.large","file:230396"],"contexts":[],"max-age":-1}},"#cache":{"contexts":[],"tags":[],"max-age":-1},"#weight":0},"file":{"fid":"230396","name":"Test1.jpg","path":"\/sites\/default\/files\/images\/Test1.jpg","fullpath":"\/var\/www\/html\/files\/public\/images\/Test1.jpg","mime":"image\/jpeg","size":61806}},"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"139721","name":"Institute for Electronics \u0026 Nanotechnology"},{"id":"10577","name":"Electrical and Computer Engineering; ECE"},{"id":"173663","name":"5G wireless"},{"id":"107","name":"Nanotechnology"},{"id":"172367","name":"3D glass packages"}]}}}