<node id="584061">
  <nid>584061</nid>
  <type>image</type>
  <uid>
    <user id="27850"><![CDATA[27850]]></user>
  </uid>
  <created>1479738238</created>
  <changed>1479738287</changed>
  <title><![CDATA[Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.]]></title>
      <body><![CDATA[ ]]></body>
    <alt><![CDATA[Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.]]></alt>
  <field_image>
    <item>
      <fid><![CDATA[222664]]></fid>
      <filename><![CDATA[expoxy molding compounds-Final-02.png]]></filename>
      <filepath><![CDATA[]]></filepath>
      <filemime><![CDATA[image/png]]></filemime>
      <filesize><![CDATA[222096]]></filesize>
      <alt><![CDATA[Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.]]></alt>
    </item>
  </field_image>
  <og_groups>
          <item>213791</item>
          <item>1237</item>
          <item>197261</item>
      </og_groups>
  <og_groups_both>
          <item><![CDATA[3D Systems Packaging Research Center]]></item>
          <item><![CDATA[College of Engineering]]></item>
          <item><![CDATA[Institute for Electronics and Nanotechnology]]></item>
      </og_groups_both>
</node>
