{"549361":{"#nid":"549361","#data":{"uid":"27863","author":"Christa Ernst","created_gmt":"2016-06-30 21:00:00","changed_gmt":"2016-10-08 02:55:43","title":"Rao Tummala","body":[],"image":{"alt":"Rao Tummala","view":{"#theme":"field","#title":"Image","#label_display":"hidden","#view_mode":"image_740","#language":"en","#field_name":"field_image","#field_type":"image","#field_translatable":false,"#entity_type":"media","#bundle":"image","#object":{},"#items":{},"#formatter":"image","#is_multiple":false,"#third_party_settings":[],"0":{"#theme":"image_formatter","#item":{},"#item_attributes":[],"#image_style":"large","#url":null,"#cache":{"tags":["config:image.style.large","file:218150"],"contexts":[],"max-age":-1}},"#cache":{"contexts":[],"tags":[],"max-age":-1},"#weight":0},"file":{"fid":"218150","name":"rt_500x500.png","path":"\/sites\/default\/files\/images\/rt_500x500_0.png","fullpath":"\/var\/www\/html\/files\/public\/images\/rt_500x500_0.png","mime":"image\/png","size":557011}},"groups":[{"id":"1271","name":"NanoTECH"}],"keywords":[{"id":"170440","name":"3D Integrated Systems"},{"id":"136711","name":"3D Packaging"},{"id":"170441","name":"Advanced Semiconductor Manufacturing"},{"id":"170442","name":"embedded ICs"},{"id":"12103","name":"Rao Tummala"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"166868","name":"the Georgia Electronic Design Center"},{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"168357","name":"The School of Materials Science and Engineering"},{"id":"170443","name":"Wafer-Level Packaging Conference"}]}}}