<![CDATA[First 2.5D glass interposer prototype fabricated using low-cost processes and panel-level chip assembly at 50 micron thick bump pitch.]]>

490021 image 1453752000 1475895218 <![CDATA[First 2.5D glass interposer prototype fabricated using low-cost processes and panel-level chip assembly at 50 micron thick bump pitch.]]> 213791