{"354881":{"#nid":"354881","#data":{"uid":"27863","author":"Christa Ernst","created_gmt":"2015-12-04 16:15:43","changed_gmt":"2016-10-08 02:51:24","title":"GIT 2014 Group","body":[],"image":{"alt":"GIT 2014 Group","view":{"#theme":"field","#title":"Image","#label_display":"hidden","#view_mode":"image_740","#language":"en","#field_name":"field_image","#field_type":"image","#field_translatable":false,"#entity_type":"media","#bundle":"image","#object":{},"#items":{},"#formatter":"image","#is_multiple":false,"#third_party_settings":[],"0":{"#theme":"image_formatter","#item":{},"#item_attributes":[],"#image_style":"large","#url":null,"#cache":{"tags":["config:image.style.large","file:202031"],"contexts":[],"max-age":-1}},"#cache":{"contexts":[],"tags":[],"max-age":-1},"#weight":0},"file":{"fid":"202031","name":"fall_2014_prc_iab1.png","path":"\/sites\/default\/files\/images\/fall_2014_prc_iab1.png","fullpath":"\/var\/www\/html\/files\/public\/images\/fall_2014_prc_iab1.png","mime":"image\/png","size":4636066}},"groups":[{"id":"1271","name":"NanoTECH"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"112031","name":"IEEE Global Interposer Technology Conference 2014"},{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"167735","name":"School of Materials Science \u0026 Engineering"},{"id":"169691","name":"student poster awards"}]}}}