{"311141":{"#nid":"311141","#data":{"uid":"27863","author":"Christa Ernst","created_gmt":"2015-12-04 15:58:46","changed_gmt":"2016-10-08 02:50:20","title":"GIT 2014 Prelim Program","body":[],"image":{"alt":"GIT 2014 Prelim Program","view":{"#theme":"field","#title":"Image","#label_display":"hidden","#view_mode":"image_740","#language":"en","#field_name":"field_image","#field_type":"image","#field_translatable":false,"#entity_type":"media","#bundle":"image","#object":{},"#items":{},"#formatter":"image","#is_multiple":false,"#third_party_settings":[],"0":{"#theme":"image_formatter","#item":{},"#item_attributes":[],"#image_style":"large","#url":null,"#cache":{"tags":["config:image.style.large","file:201748"],"contexts":[],"max-age":-1}},"#cache":{"contexts":[],"tags":[],"max-age":-1},"#weight":0},"file":{"fid":"201748","name":"announcing_git_2014_preliminary_program_-_july_2014.jpg","path":"\/sites\/default\/files\/images\/announcing_git_2014_preliminary_program_-_july_2014.jpg","fullpath":"\/var\/www\/html\/files\/public\/images\/announcing_git_2014_preliminary_program_-_july_2014.jpg","mime":"image\/jpeg","size":327033}},"groups":[{"id":"1271","name":"NanoTECH"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"98661","name":"GIT 2014"},{"id":"76491","name":"Global Interposer Workshop"},{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"84231","name":"packaging technologies"},{"id":"12103","name":"Rao Tummala"}]}}}