New content

Title Posted Type
Ph.D. Dissertation Defense - Bhuvana Krishnaswamy Fri, May 18, 2018 - 5:25pm Event
Joshua Weitz Fri, May 18, 2018 - 4:48pm Image
Space Flight and Research on the International Space Station Fri, May 18, 2018 - 3:56pm Event
Meet Astronaut Lawrence DeLucas Fri, May 18, 2018 - 3:33pm Image
Ph.D. Dissertation Defense - Nak-Seung Patrick Hyun Fri, May 18, 2018 - 3:30pm Event
Figure 5. (b) composite metal foams Fri, May 18, 2018 - 3:10pm Image
Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Fri, May 18, 2018 - 3:09pm Image
Figure 4. All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Fri, May 18, 2018 - 2:34pm Image
Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip Fri, May 18, 2018 - 2:27pm Image
Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm) Fri, May 18, 2018 - 2:18pm Image
Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Fri, May 18, 2018 - 2:11pm Image
Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Fri, May 18, 2018 - 2:06pm Image
Figure 1. New innovations in thermal management of high-density glass packages. Fri, May 18, 2018 - 2:01pm Image
Resume Workshop-interactive for MS and PHD Students Fri, May 18, 2018 - 1:54pm Event
Figure 1. New innovations in thermal management of high-density glass packages. Fri, May 18, 2018 - 1:46pm Image
Tony Giarrusso continues the discussion Atlanta's disappearing tree cover Fri, May 18, 2018 - 12:04pm External news
What is New in Packaging @ Georgia Tech? New Innovations in Thermal Management of 2.5D and 3D Packages Fri, May 18, 2018 - 11:49am News
Training By Instructure - Assignments - May 21 Fri, May 18, 2018 - 11:20am Event
PhD Defense by Dongdong Yao Fri, May 18, 2018 - 11:08am Event
Georgia Tech’s AMP-IT-UP program to Participate in 2018 NSF’s STEM for All Video Showcase to Highlight Innovation in STEM Education Fri, May 18, 2018 - 10:19am News
First Day of Class - Fall 2018 Fri, May 18, 2018 - 9:06am Event
OSP RCR Workshop - May 24, 2018 Thu, May 17, 2018 - 5:56pm Event
BME Spring Celebration of Community Thu, May 17, 2018 - 3:01pm News
Na, Ko Win Cybersecurity Demo Day Research Award Thu, May 17, 2018 - 2:50pm News
Taesik Na and Jong Hwan Ko (center) Thu, May 17, 2018 - 2:41pm Image

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