event
Ph.D. Dissertation Defense - Bijan Tehrani
Primary tabs
Title: Additive Manufacturing Solutions for Application-specific Millimeter-wave Wireless System Design and Packaging
Committee:
Dr. Manos Tentzeris, ECE, Chair , Advisor
Dr. Gregory Durgin, ECE
Dr. Andrew Peterson, ECE
Dr. Benjamin Cook, TI
Dr. Pulugurtha Raj, FIU
Abstract: This thesis outlines the convergence of additive manufacturing (AM) technology with the development of system-in-package (SiP) integration schemes for millimeter-wave (mm-Wave) wireless systems. First-of-their-kind demonstrations of fundamental system and package components, such as high gain antennas, interconnects, and “smart” chip encapsulants, are presented utilizing fully-additive printing methods. The technologies outlined in these efforts highlight the potential for AM to further increase the design flexibility of mm-Wave systems at the module and device level, offering a new precedent of rapid, application-specific reconfigurability for the next generation of wireless technology.
Status
- Workflow Status:Published
- Created By:Daniela Staiculescu
- Created:12/16/2020
- Modified By:Daniela Staiculescu
- Modified:12/16/2020
Categories
Keywords
Target Audience