Dr. John Allgair, BRIDG Program Manager

Abstract: The continuing advance of Internet based activity, including mobile devices, connected sensors and cloud based operations, is driving the microelectronics industry to come up with faster devices and smaller form factors. The traditional route to CMOS miniaturization via device level scaling is reaching its limit. Our advanced system integration program is aimed at developing solutions which address this challenge through innovative technologies aimed at package level scaling on a conventional silicon platform.

The Ultra High Density Interposer project is focused on developing stacked interposers with signal input/output (I/O) an order of magnitude higher than typically achieved. There are several pre and post processing challenges associated with such interposer development. This presentation will provide an overview of the electrical yield and reliability issues of ultra high density interposers. A status overview of the advanced system integration program being pursued at BRIDG will also be provided.

Bio: Dr. John Allgair leads the Electronic Photonic Heterogeneous Integration program at BRIDG which is focused on providing robust, cost-effective platforms for the heterogeneous integration of silicon, III/V and photonic devices to enable smart sensor integration.

Over his twenty-year career in the semiconductor industry, Dr. Allgair has worked in  roles focused on business growth, innovation and bringing new products to market during tenures at GLOBALFOUNDRIES, AMD, SEMATECH, Freescale and Motorola. His semiconductor engineering background includes advanced packaging integration, factory design, process integration, yield enhancement, lithography and materials characterization.

Dr. Allgair serves on the SPIE Advanced Lithography program committee and has multiple publications in peer reviewed, industry journals. He received a PhD in electrical engineering with an emphasis in semiconductor physics and processing from Arizona State University.