New Era of Automotive Electronics Workshop at Georgia Tech

Event Details

Ms. Patricia Allen
(404) 894-9097
351 MaRC


Summary Sentence: Georgia Tech launches Industry Consortium to address challenges in the emerging automotive electronics such as autonomous driving, all-electric cars, high power and high-temperature electronics.

Full Summary: Georgia Tech and its industry partners to launch large-scale, comprehensive R&D and supply chain program focusing on the New era of Automotive Electronics (NAE). May 24 workshop will focus on: 1) package and system integration, 2) Tier 1 and Tier 2 partnerships, and 3) educating cross-disciplinary engineering students prepared for NAE industry.  Event is free. registration required.

  • Automotive drawing Automotive drawing

Georgia Tech PRC currently has a large industry consortium involving about 50 global supply chain manufacturing and user companies from the U.S., Europe, Japan, Korea and Taiwan. Its current focus is in digital, RF, Power and Photonics – all enabled by its leading-edge research in 11 core areas that include: 1) electrical, mechanical and thermal design, 2) nano and micro materials, 3) devices, 4) electronic substrates, 5) photonic substrates, 6) high-temp electronics, 7) power electronics, 8) sensing electronics, 9) RF and mm-wave electronics, 10) EMI design and materials, and 11) interconnections and assembly.

Georgia Tech automotive industry partners include BMW, GM and Ford, to date. Additional R&D collaborations are underway with Mercedes Benz, Ferrari, Honda, and Toyota in many areas that include hybrid vehicle R&D, internal component design, communication-vehicle interactions, automated driving, driver-assist, human-robot interactions and in environmental impacts.

Current automotive-related faculty expertise at Georgia Tech include:

  • Advanced MEMS and Sensors for Automotive Systems – Prof. Klaus Wolter
  • Sensor Arrays for Media Sensing – Prof. Peter Hesketh
  • Reliability, Prognostic and Condition Monitoring – Prof. Suresh Sitaraman 
  • WBG Power Devices and Modules – Prof. Russ Dupuis
  • High-temperature Drivers – Prof. John Cressler
  • 5G Design – Prof. Manos Tentzeria
  • Thermal Management – Prof. Yogendra Joshi and Prof. Samuel Graham
  • High-temperature Molding Materials – Prof. CP Wong
  • High-bandwidth Photonics – Prof. GK Chang
  • Glass-based Digital Packages – Dr. Venky Sundaram
  • RF and Power components and modules – Dr. Raj Pulugurtha
  • Cu Interconnections Without Solders – Dr. Vanessa Smet
  • Integrated Systems – Prof. Rao Tummala

R&D projects and Industry Consortium partnerships will be covered.

Additional Information

In Campus Calendar

College of Engineering, Institute for Electronics and Nanotechnology, 3D Systems Packaging Research Center

Invited Audience
Faculty/Staff, Public
Seminar/Lecture/Colloquium, Training/Workshop
3D Packaging, Automotive Electronics, PRC
  • Created By: Karen May
  • Workflow Status: Draft
  • Created On: Apr 22, 2016 - 4:21am
  • Last Updated: Oct 7, 2016 - 10:17pm