3D Systems Packaging Research Center

Group content

Title Type Status Created Name
Nano@Tech - Bionics in Tribology: Adhesive and Frictional Dress of Elastomeric Surfaces Event Published Thu, Jun 7, 2018 - 12:52pm Christa Ernst
Ferroelectricity’s Mystery Sister may do Twice the Work for Less News Published Mon, Jun 11, 2018 - 9:52am Christa Ernst
Nano@Tech: Krish Roy, GT-BME Event Published Thu, Jun 7, 2018 - 3:08pm Christa Ernst
Nano@Tech: Ali Adibi, GT-ECE Event Published Thu, Jun 7, 2018 - 3:05pm Christa Ernst
Nano@Tech: Omer Inan, GT-ECE Event Published Thu, Jun 7, 2018 - 1:53pm Christa Ernst
Nano@Tech: Nian Liu, GT-ChBE Event Published Thu, Jun 7, 2018 - 1:51pm Christa Ernst
Nano@Tech: Xianqiao Wang - UGA-College of Engineering Event Published Thu, Jun 7, 2018 - 1:33pm Christa Ernst
Nano@Tech: Surendra Chavan - Vicapsys Event Published Thu, Jun 7, 2018 - 1:30pm Christa Ernst
Nano@Tech: Jennifer Curtis - GT Physics Event Published Thu, Jun 7, 2018 - 12:49pm Christa Ernst
Spring 2018 IEN Seed Grant Winners Announced News Published Mon, Jun 4, 2018 - 10:05am Christa Ernst
IBB Seminar - Managing the Complexity of Molecules: Letting Matter Compute Itself Event Draft Thu, May 31, 2018 - 11:02am Christa Ernst
Institute for Electronics and Nanotechnology Cleanroom Open House Event Published Thu, May 31, 2018 - 10:28am Christa Ernst
What is New in Packaging @ Georgia Tech? New Innovations in Thermal Management of 2.5D and 3D Packages News Published Fri, May 18, 2018 - 11:49am cheath6
Spring 2018: 2nd Annual IEN Technical Exchange Conference Event Published Fri, May 4, 2018 - 1:23pm Christa Ernst
NanoFANS Forum Focusing on “Biophotonics in Medical Diagnostics!" Event Published Fri, May 4, 2018 - 12:03pm Christa Ernst
Announcing the Spring 2018 NanoFANS Forum Event Focus: Biophotonics in Medical Diagnostics Event Published Wed, Apr 25, 2018 - 2:26pm Christa Ernst
Nano@Tech: Real-Time Measurements of Magnetic Dynamics in Single Ni Nanoparticles Event Published Tue, Dec 5, 2017 - 12:20pm Christa Ernst
What’s New in Packaging @ Georgia Tech? Wafer Fan-Out is a Great Success. What Next? News Published Fri, Apr 13, 2018 - 12:57pm cheath6
What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging News Published Fri, Apr 6, 2018 - 2:47pm cheath6
ELECTRON BEAM LITHOGRAPHY SEMINAR WITH ELIONIX Event Published Wed, Apr 11, 2018 - 10:39am Christa Ernst

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Group feeds

Title Type Created Updated Name
PRC Events Custom Feed Manual feed Tuesday, October 6, 2015 - 7:46am Friday, November 20, 2015 - 10:15am Karen May
CoE Auto News Feed Manual feed Thursday, October 15, 2015 - 1:10pm Thursday, October 15, 2015 - 5:10pm Karen May
CoE Auto Events Feed Automated feed Thursday, October 15, 2015 - 4:57pm Thursday, October 15, 2015 - 5:03pm Karen May
Auto Feed - News from IEN Automated feed Tuesday, October 6, 2015 - 4:42pm Tuesday, October 6, 2015 - 4:42pm Karen May
IEN - Automatic News Manual feed Thursday, July 30, 2015 - 7:37am Thursday, July 30, 2015 - 11:37am Christa Ernst
IEN - Manual Events Manual feed Thursday, April 10, 2014 - 11:45am Thursday, August 21, 2014 - 4:57pm Eric Sembrat
IEN - Manual News Manual feed Tuesday, April 22, 2014 - 7:51am Wednesday, May 21, 2014 - 8:09am Eric Sembrat

Group media

Image Title Type Created Name
Undergraduate students from the NSF REU in Nanotechnology at the Marcus Nanotechnology Building on August the 2nd, 2018. 2018 SENIC REU Participants Image Friday, August 3, 2018 - 12:56pm Christa Ernst
Zirconia Crystal Structure Image Monday, June 11, 2018 - 9:47am Christa Ernst
Asif Khan in the Lab Image Monday, June 11, 2018 - 9:51am Christa Ernst
Fall 2017 Seed Grant Winner at the IEN User Poster Session on May 21, 2018 - Arith Rajapaks Arith Rajapaks Poster Image Monday, June 4, 2018 - 10:08am Christa Ernst
Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip Image Friday, May 18, 2018 - 2:27pm cheath6
Figure 5. (b) composite metal foams Figure 5. (b) composite metal foams Image Friday, May 18, 2018 - 3:10pm cheath6
Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Image Friday, May 18, 2018 - 3:09pm cheath6
Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Figure 4. All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Image Friday, May 18, 2018 - 2:34pm cheath6
Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Image Friday, May 18, 2018 - 2:06pm cheath6
Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Image Friday, May 18, 2018 - 2:11pm cheath6
Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness 1 mm) vs. copper plated PCB (total thickness 1 mm) Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm) Image Friday, May 18, 2018 - 2:18pm cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Image Friday, May 18, 2018 - 2:01pm cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Figure 1. New innovations in thermal management of high-density glass packages. Image Friday, May 18, 2018 - 1:46pm cheath6
Figure 6. First Ever 2.5D GPE package at 40um I/O pitch Image Friday, April 13, 2018 - 2:06pm cheath6
Figure 5. Ultra-Thin (200um) GPE Demo at GT Image Friday, April 13, 2018 - 2:01pm cheath6
Figure 4. First Demo of Si-Like RDL on Glass Panels Image Friday, April 13, 2018 - 1:53pm cheath6
Figure 2. High Precision and High Throughput Glass Cavities Figure 2. High Precision and High Throughput Glass Cavities Image Friday, April 13, 2018 - 1:18pm cheath6
Figure 3. First Demo of 40um I/O Pitch Embedding with <2um Die Shift Figure 3. First Demo of 40um I/O Pitch Embedding with <2um Die Shift Image Friday, April 13, 2018 - 1:31pm cheath6
Figure 2. High Precision and High Throughput Glass Cavities Figure 1. Glass Panel Embedded (GPE) packages with integrated TPVs. Image Friday, April 13, 2018 - 1:07pm cheath6
What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging Image Tuesday, April 10, 2018 - 4:58pm cheath6

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