3D Systems Packaging Research Center

Group content

Title Type Status Created Name
What is New in Packaging @ Georgia Tech? New Innovations in Thermal Management of 2.5D and 3D Packages News Published Fri, May 18, 2018 - 11:49am cheath6
Spring 2018: 2nd Annual IEN Technical Exchange Conference Event Published Fri, May 4, 2018 - 1:23pm Christa Ernst
NanoFANS Forum Focusing on “Biophotonics in Medical Diagnostics!" Event Published Fri, May 4, 2018 - 12:03pm Christa Ernst
Announcing the Spring 2018 NanoFANS Forum Event Focus: Biophotonics in Medical Diagnostics Event Published Wed, Apr 25, 2018 - 2:26pm Christa Ernst
Nano@Tech: Real-Time Measurements of Magnetic Dynamics in Single Ni Nanoparticles Event Published Tue, Dec 5, 2017 - 12:20pm Christa Ernst
What’s New in Packaging @ Georgia Tech? Wafer Fan-Out is a Great Success. What Next? News Published Fri, Apr 13, 2018 - 12:57pm cheath6
What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging News Published Fri, Apr 6, 2018 - 2:47pm cheath6
ELECTRON BEAM LITHOGRAPHY SEMINAR WITH ELIONIX Event Published Wed, Apr 11, 2018 - 10:39am Christa Ernst
Georgia Tech and its Industry Partners Develop Via-in-Trench with Upto 10X Improvement in I/O Density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/Layer News Draft Tue, Apr 10, 2018 - 10:48am cheath6
What is new in Packaging @ Georgia Tech? 5G Systems in 3D News Published Fri, Mar 30, 2018 - 12:51pm cheath6
Nano@Tech: Suren Chavan - CANCELLED Event Published Tue, Dec 5, 2017 - 12:12pm Christa Ernst
Mixed-signal Processing Powers Bio-mimetic CMOS Chip to Enable Neural Learning in Autonomous Micro-Robots News Published Mon, Mar 12, 2018 - 10:48am Christa Ernst
Nano@Tech: Nanotechnology, Risks, and Regulatory Options with Richard Barke Event Published Tue, Dec 5, 2017 - 12:10pm Christa Ernst
"Why Do We Look Up at the Heavens?" — Br. Guy Consolmagno Director of the Vatican Observatory, Rome Event Published Tue, Feb 20, 2018 - 10:21am Christa Ernst
EDA’s CAEML Grows More Humps: Al Expands Role in Design News Published Thu, Feb 15, 2018 - 11:48am Christa Ernst
Nano@Tech: Microfluidic Circuits and Biomedical Applications Event Published Tue, Dec 5, 2017 - 12:03pm Christa Ernst
Nano@Tech: MEMS-Based Hemodynamic Monitoring for Advanced Heart Failure Management Event Published Tue, Dec 5, 2017 - 12:01pm Christa Ernst
Nano@Tech: Nonlinear Interactions in Nano/Microelectromechanical Systems (N/MEMS) Event Published Tue, Dec 5, 2017 - 11:54am Christa Ernst
Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) partners with Notre Dame in $26 million multi-university research center developing next-generation computing technologies News Published Fri, Jan 26, 2018 - 11:02am Christa Ernst
Georgia Tech and NextFlex Team-Up to Make the Internet-of-Things More Flexible & Power Efficient News Published Thu, Dec 7, 2017 - 11:52am Christa Ernst

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Group feeds

Title Type Created Updated Name
PRC Events Custom Feed Manual feed Tuesday, October 6, 2015 - 7:46am Friday, November 20, 2015 - 10:15am Karen May
CoE Auto News Feed Manual feed Thursday, October 15, 2015 - 1:10pm Thursday, October 15, 2015 - 5:10pm Karen May
CoE Auto Events Feed Automated feed Thursday, October 15, 2015 - 4:57pm Thursday, October 15, 2015 - 5:03pm Karen May
Auto Feed - News from IEN Automated feed Tuesday, October 6, 2015 - 4:42pm Tuesday, October 6, 2015 - 4:42pm Karen May
IEN - Automatic News Manual feed Thursday, July 30, 2015 - 7:37am Thursday, July 30, 2015 - 11:37am Christa Ernst
IEN - Manual Events Manual feed Thursday, April 10, 2014 - 11:45am Thursday, August 21, 2014 - 4:57pm Eric Sembrat
IEN - Manual News Manual feed Tuesday, April 22, 2014 - 7:51am Wednesday, May 21, 2014 - 8:09am Eric Sembrat

Group media

Image Title Type Created Name
Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip Image Friday, May 18, 2018 - 2:27pm cheath6
Figure 5. (b) composite metal foams Figure 5. (b) composite metal foams Image Friday, May 18, 2018 - 3:10pm cheath6
Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Image Friday, May 18, 2018 - 3:09pm cheath6
Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Figure 4. All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Image Friday, May 18, 2018 - 2:34pm cheath6
Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Image Friday, May 18, 2018 - 2:06pm cheath6
Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Image Friday, May 18, 2018 - 2:11pm cheath6
Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness 1 mm) vs. copper plated PCB (total thickness 1 mm) Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm) Image Friday, May 18, 2018 - 2:18pm cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Image Friday, May 18, 2018 - 2:01pm cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Figure 1. New innovations in thermal management of high-density glass packages. Image Friday, May 18, 2018 - 1:46pm cheath6
Figure 6. First Ever 2.5D GPE package at 40um I/O pitch Image Friday, April 13, 2018 - 2:06pm cheath6
Figure 5. Ultra-Thin (200um) GPE Demo at GT Image Friday, April 13, 2018 - 2:01pm cheath6
Figure 4. First Demo of Si-Like RDL on Glass Panels Image Friday, April 13, 2018 - 1:53pm cheath6
Figure 2. High Precision and High Throughput Glass Cavities Figure 2. High Precision and High Throughput Glass Cavities Image Friday, April 13, 2018 - 1:18pm cheath6
Figure 3. First Demo of 40um I/O Pitch Embedding with <2um Die Shift Figure 3. First Demo of 40um I/O Pitch Embedding with <2um Die Shift Image Friday, April 13, 2018 - 1:31pm cheath6
Figure 2. High Precision and High Throughput Glass Cavities Figure 1. Glass Panel Embedded (GPE) packages with integrated TPVs. Image Friday, April 13, 2018 - 1:07pm cheath6
What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging Image Tuesday, April 10, 2018 - 4:58pm cheath6
Georgia Tech and its Industry Partners Develop Via-in-Trench with Upto 10X Improvement in I/O Density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/Layer Figure 1 Image Tuesday, April 10, 2018 - 10:51am cheath6
GT Steam Tower Spring 2018 ATL Campus Steam Tower Image Wednesday, April 4, 2018 - 9:09am Christa Ernst
5G Modules from large glass panels 5G Modules from large glass panels Image Friday, March 30, 2018 - 12:18pm cheath6
5G bandpass filters with ultra-small footprint on glass 5G bandpass filters with ultra-small footprint on glass Image Friday, March 30, 2018 - 12:18pm cheath6

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